David Atienza Alonso received his MSc and PhD degrees in Computer Science and Engineering from Complutense Univ. of Madrid (UCM), Spain, and IMEC, Belgium, in 2001 and 2005.
Currently he is an associate professor of electrical and computer engineering, and head of the Embedded Systems Laboratory (ESL) at the Swiss Federal Institute of Technology Lausanne (EPFL), Switzerland.
His research interests include system-level design methodologies for high-performance multi-processor system-on-chip (MPSoC) and low-power Internet-of-Things (IoT) systems, including new 2-D/3-D thermal-aware design for MPSoCs and many-core servers, ultra-low power system architectures for wireless body sensor nodes and edge computing, HW/SW reconfigurable systems, dynamic memory optimizations, and network-on-chip design.
He is a co-author of more than 250 publications in peer-reviewed international journals and conferences, several book chapters, and eight U.S. patents in these fields. He has earned several best paper awards and he is (or has been) an Associate Editor of IEEE TC, IEEE D&T, IEEE T-TCAD, IEEE T-SUSC and Elsevier Integration. He was the Technical Programme Chair of IEEE/ACM DATE 2015 and General Programme Chair of IEEE/ACM DATE 2017.
Dr. Atienza received the DAC Under-40 Innovators Award in 2018, the IEEE TCCPS Mid-Career Award in 2018, an ERC Consolidator Grant in 2016, the IEEE CEDA Early Career Award in 2013, the ACM SIGDA Outstanding New Faculty Award in 2012, and a Faculty Award from Sun Labs at Oracle in 2011. He is an IEEE Fellow and an ACM Distinguished Member.
ESL focuses on the definition of thermal-aware design, multi-objective optimization methodologies and system level exploration tools for Internet of Things (IoT) systems, including MPSoC edge embedded systems, high-performance many-core computing, and low-power wireless sensor networks (WSNs). These goals involve the development of novel thermal and reliability exploration frameworks and HW/SW management approaches for 2D/3D MPSoCs and IoT systems. Also, ESL is active on system-level design and energy management for body-area WSNs. In all ESL research activities, the industrial links are key to enable the adoption of the different proposed research solutions by the IoT industry and embedded systems manufacturers.
In thermal/reliability modeling and management for 2D/3D MPSoCs and datacenter design, ESL cooperates with IBM Zurich (CH), Credit Suisse (CH), Oracle (US), Stanford Univ. (US), ETHZ (CH), Boston University (US), IMEC (BE), and Eaton (FR).
In system-level design and energy management for IoT and body-area WSNs, ESL is working with the Nestlé (CH), Nespresso (CH), Holst Centre (NL), University of Lugano (CH), Univ. of Bologna (IT), CHUV (CH), and Smarcardia (CH). Also, ESL has been part for several years of the European Network of Excellence on High Performance and Embedded Architecture and Compilation (HiPEAC).